专利名称：Conductive composition发明人：三原 尚明,切替 徳之,杉山 二朗申请号：JP2017510424申请日：20160722公开号：JP6655605B2公开日：20200226
摘要： An object of the present invention is to provide a means which is excellent inheat resistance and mounting reliability, is lead-free and has small addition to theenvironment when the semiconductor power element is bonded to the metal lead frame.That is, a conductive composition containing a sulfide compound represented by at leastR-S-R 'and metal particles containing at least one of Cu, Sn, and Ni as essential
components.(R is an organic group containing at least carbon and R 'is an organic groupwhich is the same as or different from R. Note that R and R' may be bonded, that is, so-called cyclic sulfide. And a conductive paste, a conductive adhesive film produced by usingthe conductive composition, and a dicing die bonding film obtained by bonding theconductive adhesive film and an adhesive tape.
申请人：古河電気工業株式会社
地址：東京都千代田区丸の内二丁目２番３号
国籍：JP
代理人：井上 誠一
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