专利名称：High-impedance substrate, antenna device
and mobile radio device
发明人：Higaki, Makoto,Inoue, Kazuhiro,Sekine,
Shuichi,Tsujimura, Akihiro
申请号：EP07254747.4申请日：20071207公开号：EP1939982A1公开日：20080702
专利附图：
摘要：There is provided with a high-impedance substrate including: a finite groundplane (1); a plurality of metal plates (2) arranged at a predetermined height from the
finite ground plane (1) and in a matrix pattern such that respective faces thereof areapproximately parallel to the finite ground plane (1); and a plurality of linear conductiveelements (3) configured to connect the plurality of metal plates (2) to the finite groundplane (1) and, wherein outer metal plates (2) arranged at an outermost periphery amongthe plurality of metal plates (2) are connected with the linear conductive elements (3) atedges of the outer metal plates (2).
申请人：KABUSHIKI KAISHA TOSHIBA
地址：1-1, Shibaura 1-chome, Minato-ku Tokyo 105-8001 JP
国籍：JP
代理机构：Granleese, Rhian Jane
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